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 DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D186
MPSH10 NPN 1 GHz general purpose switching transistor
Product specification Supersedes data of September 1995 File under Discrete Semiconductors, SC14 1998 Aug 27
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
FEATURES * Low cost * High power gain. DESCRIPTION Silicon NPN general purpose transistor in a SOT54 (TO-92) package. PNP complement is the MPSH81. PINNING PIN 1 2 3 DESCRIPTION collector emitter base
page
MPSH10
1
2 3
MSB033
Marking code: PSH10.
Fig.1 SOT54.
QUICK REFERENCE DATA SYMBOL VCBO VCEO VEBO Ptot Tj hFE Cre Crb fT rbCc Note 1. Ts is the temperature at the soldering point of the collector lead, 4 mm from the body. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCBO VCEO VEBO IC Ptot Tstg Tj Note 1. Ts is the temperature at the soldering point of the collector lead, 4 mm from the body. PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) total power dissipation storage temperature junction temperature Ts = 25 C; note 1 open base open collector CONDITIONS open emitter MIN. - - - - - -65 - MAX. 30 25 3 40 1 +150 150 UNIT V V V mA W C C PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage total power dissipation junction temperature DC current gain collector-base feedback capacitance transition frequency collector-base time constant VCE = 10 V; IC = 4 mA VCB = 10 V; IE = 0; f = 1 MHz VCE = 10 V; IC = 4 mA; f = 100 MHz; Tamb = 25 C VCE = 10 V; IC = 4 mA; f = 100 MHz; Tamb = 25 C collector-emitter feedback capacitance VCB = 10 V; IE = 0; f = 1 MHz open base open collector Ts = 25 C; note 1 CONDITIONS open emitter MIN. - - - - - 60 - 0.35 650 - MAX. 30 25 3 1 150 - 0.7 0.65 - 9 pF pF MHz ps V V V W C UNIT
1998 Aug 27
2
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
THERMAL CHARACTERISTICS SYMBOL Rth j-s Rth j-a Note 1. Ts is the temperature at the soldering point of the collector lead, 4 mm from the body. PARAMETER thermal resistance from junction to soldering point thermal resistance from junction to ambient CONDITIONS note 1
MPSH10
VALUE 125 250
UNIT K/W K/W
CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL V(BR)CBO V(BR)CEO V(BR)EBO VCEsat VBEon ICBO IEBO hFE Cre Crb fT rbCc PARAMETER collector-base breakdown voltage collector-emitter breakdown voltage emitter-base breakdown voltage collector-emitter saturation voltage base-emitter ON voltage collector-base cut-off current emitter-base cut-off current DC current gain collector-emitter feedback capacitance collector-base feedback capacitance transition frequency collector-base time constant CONDITIONS open emitter; IC = 100 A; IE = 0 open base; IC = 1 mA; IB = 0 open collector; IE = 10 A; IC = 0 IC = 4 mA; IB = 0.4 mA VCE = 10 V; IC = 4 mA VCB = 25 V; IE = 0 VCB = 25 V; IC = 0 VCE = 10 V; IC = 4 mA VCB = 10 V; IE = ie = 0; f = 1 MHz VCB = 10 V; IC = ic = 0; f = 1 MHz VCE = 10 V; IC = 4 mA; f = 100 MHz; Tamb = 25 C VCB = 10 V; IC = 4 mA; f = 100 MHz; Tamb = 25 C MIN. 30 25 3 - - - - 60 - 0.35 650 - MAX. - - - 0.5 0.95 100 100 - 0.7 0.65 - 9 pF pF MHz ps UNIT V V V V V nA nA
1998 Aug 27
3
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
MPSH10
handbook, halfpage
100 Y11
MRA154
handbook, halfpage
-10 b11
MRA156
(mS) 80 g11 60 -b11 40
(mS) -20
-30
1000 MHz
-40
700 400
20
-50
200 100
0 102
f (MHz)
103
-60
0
20
40
60
80 100 g11 (mS)
VCB = 10 V; IC = 4 mA.
Fig.2
Common base input admittance (Y11) as a function of frequency.
VCB = 10 V; IC = 4 mA.
Fig.3 Common base input admittance (Y11).
handbook, halfpage
70
MRA155
Y21 (mS)
handbook, halfpage
60 b21
MRA157
200
400 600 700
b21
(mS) 50 100
50
30
-g21
40
10
30
1000 MHz
-10
20
-30 102
f (MHz)
103
10 -70
-50
-30
-10
10 30 g21 (mS)
VCB = 10 V; IC = 4 mA.
VCB = 10 V; IC = 4 mA.
Fig.4
Common base forward transfer admittance (Y21) as a function of frequency.
Fig.5
Common base forward transfer admittance (Y21).
1998 Aug 27
4
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
MPSH10
handbook, halfpage
5
MRA150
Y12 (mS)
handbook, halfpage
0
MRA152
b12 (mS)
100 200 400
4
-1
3
-2
700
2
-b12
-3
1000 MHz
1 g12 f (MHz) 103
-4
0 102
-5 -2
-1.2
-0.4
0.4
1.2 2 g12 (mS)
VCB = 10 V; IC = 4 mA.
VCB = 10 V; IC = 4 mA.
Fig.6
Common base reverse transfer admittance (Y12) as a function of frequency.
Fig.7
Common base reverse transfer admittance (Y12).
handbook, halfpage
10
MRA151
Y22 (mS)
handbook, halfpage
10
MRA153
b22 (mS)
1000 MHz
8
8 700 MHz
6 b22 4
6
4
400 MHz
200 MHz 2 g22 0 102 0 0 2 4 6 8 10 g22 (mS) 2 100 MHz
f (MHz)
103
VCB = 10 V; IC = 4 mA. VCB = 10 V; IC = 4 mA.
Fig.8
Common base reverse admittance (Y22) as a function of frequency.
Fig.9 Common base reverse admittance (Y22).
1998 Aug 27
5
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
PACKAGE OUTLINE Plastic single-ended leaded (through hole) package; 3 leads
MPSH10
SOT54
c
E d A L b
1
D
2
e1 e
3
b1
L1
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 5.2 5.0 b 0.48 0.40 b1 0.66 0.56 c 0.45 0.40 D 4.8 4.4 d 1.7 1.4 E 4.2 3.6 e 2.54 e1 1.27 L 14.5 12.7 L1(1) 2.5
Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION SOT54 REFERENCES IEC JEDEC TO-92 EIAJ SC-43 EUROPEAN PROJECTION ISSUE DATE 97-02-28
1998 Aug 27
6
Philips Semiconductors
Product specification
NPN 1 GHz general purpose switching transistor
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
MPSH10
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Aug 27
7
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125104/00/04/pp8
Date of release: 1998 Aug 27
Document order number:
9397 750 04297


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